Title: Advanced Packaging Materials and Techniques for High Power TR Module
Author: James Hoffman
Organization: Jet Propulsion Laboratory
Co-Authors: Linda DelCastillo, Jennifer Miller, Gajanana Birur, Masud Jenabi

High power, highly integrated RF electronics are susceptible to intense stress due to thermal cycling of the disparate materials required to meet requirements. This is especially true for the high power TR module being developed for instruments such as the proposed DESDynI radar, which combine many materials in small form factors and undergo significant mode changes leading to large thermal excursions. We have designed thermally stabilized T/R modules using new materials for improved thermal performance of electronics. We combined advanced substrate and housing materials with thermal reservoir material, and developed new packaging techniques, improving thermal-cycling reliability and performance stability over temperature.
We will show results comparing TR modules using advanced packaging versus standard practice flight packaging.